منابع مشابه
Wafer-to-Wafer Bonding for Microstructure Formation
Wafer-to-wafer bonding processes for microstructure fabrication are categorized and described. These processes have an impact in packaging and structure design. Processes are categorized into direct bonds, anodic bonds, and bonds with intermediate layers. Representative devices using wafer-to-wafer bonding are presented. Processes and methods for characterization of a range of bonding methods a...
متن کاملHydrophobic silicon wafer bonding
Wafers prepared by an HF dip without a subsequent water rinse were bonded at room temperature and annealed at temperatures up to 1100 “C. Based on substantial differences between bonded hydrophilic and hydrophobic Si wafer pairs in the changes of the interface energy with respect to temperature, secondary ion mass spectrometry (SIMS) and transmission electron microscopy (TEM), we suggest that h...
متن کاملSimple room temperature bonding of thermoplastics and poly(dimethylsiloxane).
We describe a simple and versatile method for bonding thermoplastics to elastomeric polydimethylsiloxane (PDMS) at room temperature. The bonding of various thermoplastics including polycarbonate (PC), cyclic olefin copolymer (COC), polymethylmethacrylate (PMMA), and polystyrene (PS), to PDMS has been demonstrated at room temperature. An irreversible bonding was formed instantaneously when the t...
متن کاملImproved Resin–Zirconia Bonding by Room Temperature Hydrofluoric Acid Etching
This in vitro study was conducted to evaluate the shear bond strength of "non-self-adhesive" resin to dental zirconia etched with hydrofluoric acid (HF) at room temperature and to compare it to that of air-abraded zirconia. Sintered zirconia plates were air-abraded (control) or etched with 10%, 20%, or 30% HF for either 5 or 30 min. After cleaning, the surfaces were characterized using various ...
متن کاملUV Activation Treatment for Hydrophobic Wafer Bonding
Enhanced hydrophobic bond-strength can be achieved by exposing prime grade silicon wafers to ultraviolet (UV) light and heat prior to bonding. The following independent variables were explored: platen temperature, UV exposure time, oxygen containing versus non-oxygen containing (nitrogen only) bonding atmosphere, and annealing temperature. The results suggest exposure to UV can be used as an ac...
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ژورنال
عنوان ژورنال: Hyomen Kagaku
سال: 2005
ISSN: 0388-5321,1881-4743
DOI: 10.1380/jsssj.26.82